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半导体器件用陶瓷基片材料发展现状

张伟儒 郑彧 李正 高崇 童亚琦

真空电子技术Issue(5):20-23,4.
真空电子技术Issue(5):20-23,4.

半导体器件用陶瓷基片材料发展现状

Development of Ceramic Substrate Materials for Semiconductor Devices

张伟儒 1郑彧 1李正 1高崇 1童亚琦1

作者信息

  • 1. 北京中材人工晶体研究院有限公司,北京100018
  • 折叠

摘要

Abstract

Ceramic materials are important substrate materials for semiconductor devices because of their excellent mechanical strength,high melting point,high hardness,high wear resistance and oxidation resistance.This paper introduces the performance and application of some commonly used ceramics such as beryllium oxide,alumina and aluminum nitride.The paper also describes the physical and mechanical properties of silicon nitride ceramic as a new kind of ceramic substrate material.The advantages of silicon nitride ceramic substrate on semiconductor devices are analyzed and its application prospects are also looked forward.

关键词

半导体/陶瓷绝缘基板/氮化硅陶瓷/热导率

Key words

Semiconductor/Ceramic substrate/Silicon nitride ceramic/Thermal conductivity

分类

信息技术与安全科学

引用本文复制引用

张伟儒,郑彧,李正,高崇,童亚琦..半导体器件用陶瓷基片材料发展现状[J].真空电子技术,2017,(5):20-23,4.

基金项目

北京市科技计划课题(Z171100002017015) (Z171100002017015)

真空电子技术

1002-8935

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