真空电子技术Issue(5)：39-42,4.
陶瓷-金属封接部件的失效分析
Failure Mode Analysis of Ceramic-Metal Sealing Parts
陈昀 1杨磊 1梁田 1林雄文1
作者信息
- 1. 南京三乐集团有限公司,江苏南京211800
- 折叠
摘要
Abstract
In this study,the failure phenomena of ceramic-metal sealing parts were analyzed by metallographic analysis,scanning electron microscopy and energy dispersive X-ray spectrometer.The main reasons for the failure of sealing parts were found out,and the corresponding control measures were proposed.关键词
陶瓷-金属封接/焊料渗透/开裂/显微组织/封接强度Key words
Ceramic-metal sealing/Solder penetration/Ceramic cracking/Microstructure/Sealing intension引用本文复制引用
陈昀,杨磊,梁田,林雄文..陶瓷-金属封接部件的失效分析[J].真空电子技术,2017,(5):39-42,4.
