真空电子技术Issue(5)：51-54,83,5.
陶瓷-金属封接二次金属化研究
Study on the Second Metalizing Process of Ceramic-Metal Sealing
何晓梅 1刘慧卿 1王晓宁 1赵崇霞 1张静 1丁一牧1
作者信息
- 1. 北京真空电子技术研究所,北京100015
- 折叠
摘要
Abstract
Ceramic-metal sealing process is studied by using microstructure analysis and performance tests.Technological experiments focus on the second metalizing layer.The result shows that using electroplating Cu as the second metalizing layer is feasible,and the quondam second metalizing layer could be cancelled.关键词
显微结构分析/性能测试/陶瓷-金属封接/二次金属化层Key words
Microstructure analysis/Performance test/Ceramic-metal sealing/Second metalizing layer分类
通用工业技术引用本文复制引用
何晓梅,刘慧卿,王晓宁,赵崇霞,张静,丁一牧..陶瓷-金属封接二次金属化研究[J].真空电子技术,2017,(5):51-54,83,5.
