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Thermal effect analysis of silicon microring optical switch for on-chip interconnect

Xiongfeng Fang Lin Yang

半导体学报（英文版）2017，Vol.38Issue(10)：70-74,5.

半导体学报（英文版）2017，Vol.38Issue(10)：70-74,5.DOI:10.1088/1674-4926/38/10/104004

Xiongfeng Fang ¹Lin Yang²

作者信息

1. State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
2. College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049,China
折叠

optical interconnect/microring optical switch/thermo-optic effect/thermal crosstalk/dynamic response

optical interconnect/microring optical switch/thermo-optic effect/thermal crosstalk/dynamic response

Xiongfeng Fang,Lin Yang..Thermal effect analysis of silicon microring optical switch for on-chip interconnect[J].半导体学报（英文版）,2017,38(10):70-74,5.

Project supported by the Natural National Science Foundation of China (Nos.61235001,61575187,61535002). （Nos.61235001,61575187,61535002）

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ISSN：1674-4926

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