电焊机2017，Vol.47Issue(9)：57-61,5.DOI:10.7512/j.issn.1001-2303.2017.09.12
QFP元件引脚钎焊温度场的瞬态数值模拟
Transient numerical simulation of temperature field in laser soldering of QFP element
焦万才 1杜银2
作者信息
- 1. 沈阳大学机械工程学院,辽宁沈阳110044
- 2. 沈阳新松机器人自动化股份有限公司,辽宁沈阳110168
- 折叠
摘要
Abstract
As the integrated electronic components density is getting higher,the distance among electronic component is shortened and the gap of pins is shortened,which has increased the difficulty of encapsulation techniques.Good encapsulation techniques not only can guarantee nice capability of electronics,but also should guarantee connect function.If the solder joints of pin have some problems,all the capability of electronics will be affected.The encapsulation technique of microelectronic element becomes one of the key determinants of product capability,so the study about it is very important.This article uses the numerical simulation analysis to describe the temperature field distribution of electronic element pins during welding.We can build the model and load the date by using COMSOL,then analyze the boundary conditions,at least calculate the temperature field distribution and simulate the changing process of solder.关键词
电子元件/软钎焊/温度场分布/模拟/COMSOLKey words
electronic components/soldering/temperature field distribution/simulation/COMSOL分类
矿业与冶金引用本文复制引用
焦万才,杜银..QFP元件引脚钎焊温度场的瞬态数值模拟[J].电焊机,2017,47(9):57-61,5.
