无机材料学报2017，Vol.32Issue(9)：985-990,6.DOI:10.15541/jim20160664
金刚石线锯切割多晶硅片表面制绒工艺研究
Technology of Preparing Diamond Wire Cut Multicrystalline Silicon Wafer Texture Surface
摘要
Abstract
The texturization technology of multicrystalline silicon wafers is the key step of solar cell manufacture. Based on the acid etching technology widely used in industrial-scale manufacture, the influence of etching time and the components concentration of etching solution on the structure of texturization surface and reflectivity were inves-tigated. In addition, the metal-catalyzed chemical etching technology was used to process the texture surface. The etching solution used in this method consists of hydrofluoric acid (HF) and silver nitrate (AgNO3). At the same time, the texture surface and reflectivity of silicon wafers etched by these two technologies were compared to select the ideal texture surface with uniform structure and low reflectivity. The results show that the best texture surface structure and reflectivity can be obtained under following reaction conditions: concentrations of HF and AgNO3 of 4.6 mol/L and 0.02 mol/L, respectively, reaction time of 90 min, and room temperature. The average reflectivity of silicon wafer after etching in this condition is 8 %, which is far lower than that by traditional method in current industry.关键词
金刚石线锯/多晶硅/制绒/反射率Key words
diamond wire-sawing/multicrystalline silicon/texturization/reflectivity分类
信息技术与安全科学引用本文复制引用
武晓玮,李佳艳,谭毅..金刚石线锯切割多晶硅片表面制绒工艺研究[J].无机材料学报,2017,32(9):985-990,6.基金项目
国家自然科学基金(51574057) （51574057）
中央高校基本科研业务费专项资金(DUT15QY07) National Natural Science Funds of China (51574057) （DUT15QY07）
Fundamental Research Funds for the Central Universities (DUT15QY07) （DUT15QY07）
