制冷学报2017，Vol.38Issue(5)：82-92,11.DOI:10.3969/j.issn.0253-4339.2017.05.082
通信机柜半导体制冷装置的性能测试
Experimental Study on Performance of Semiconductor Cooling Device for Communication Cabinet Cooling
摘要
Abstract
In this study, a cabinet semiconductor cooling device was designed and its refrigerating capacity and cooling efficiency were tested using a test platform. The performance parameters were obtained according to test-based analyses of the refrigerating capacity, cool-ing efficiency, and other factors. According to the test results, for an average indoor temperature of 26 ℃ and 200-360 W input power, the cooling efficiency first increases and then decreases, reaching a maximum value of 69. 5% when the input power is 232 W. Mean-while, the average cooling capacity of the refrigeration chamber is 455. 46 kJ and the power of the semiconductor cooling device is 151. 8 W, which can remove 3. 04% of the energy in a 5 kW communication cabinet.关键词
通信机柜/半导体制冷/制冷效率Key words
communications cabinet/semiconductor refrigeration/refrigerating efficiency分类
通用工业技术引用本文复制引用
杨晚生,陈世林,毕崟..通信机柜半导体制冷装置的性能测试[J].制冷学报,2017,38(5):82-92,11.基金项目
本文受广东省2015年公益项目(第一批) (2014A010106031),广东省中国科学院全面战略合作专项资金竞争性分配项目(2013B091500094 ) 和欧盟 2020 研究和创新基金项目( 734340-DEW-COOL-4-CDC-MSCA-RIS ) 资助.The project was supported by the first batch of Guangdong Province 2015 Pub-lic Welfare Program (No. 2014A010106031), the Competitive Allocation of Special Funds in Guangdong province China Acade-my of Sciences Comprehensive Strategic (No. 2013B091500094) and Orizon 2020-Research and Innovation Framework Programme ( No. 734340-DEW-COOL-4-CDC-MSCA-RIS) . （第一批）
