ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layerOA

作者：Zhang Liang;Yang Fan;Zhong Sujuan

作者单位：School of Mechanical &Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, P.R.ChinaSchool of Mechanical &Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, P.R.ChinaState Key Laboratory of Advanced Brazing Filler Metals&Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, P.R.China

中文关键词：ZnO whiskersreflow solderingshort circuiting failureelectronic device

英文关键词：ZnO whiskersreflow solderingshort circuiting failureelectronic device

刊名：《高技术通讯（英文版）》 2017 (3)

相关项目：3D封装芯片瞬时液相键合的记忆焊点改性机理及可靠性研究

页码/页数：337-341,5

基金：Supported by the National Natural Science Foundation of China (No.51475220), the State Foundation of Laboratory of Advanced Brazing Fill-er Metals&Technology (Zhengzhou Research Institute of Mechanical Engineering) (No.SKLABFMT-2015-03) and High Level Talent Plan of Jiangsu Normal University ( No.YQ2015002) .

DOI：10.3772/j.issn.1006-6748.2017.03.016