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ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer

Zhang Liang Yang Fan Zhong Sujuan

高技术通讯（英文版）2017，Vol.23Issue(3)：337-341,5.

高技术通讯（英文版）2017，Vol.23Issue(3)：337-341,5.DOI:10.3772/j.issn.1006-6748.2017.03.016

ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer

Zhang Liang ¹Yang Fan ¹Zhong Sujuan²

作者信息

1. School of Mechanical &Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, P.R.China
2. State Key Laboratory of Advanced Brazing Filler Metals&Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, P.R.China
折叠

摘要

关键词

ZnO whiskers/reflow soldering/short circuiting failure/electronic device

Key words

ZnO whiskers/reflow soldering/short circuiting failure/electronic device

引用本文复制引用

Zhang Liang,Yang Fan,Zhong Sujuan..ZnO whiskers growth on the surface of Sn9 Zn/Cu solder joints in concentrator silicon solar cells solder layer[J].高技术通讯（英文版）,2017,23(3):337-341,5.

基金项目

Supported by the National Natural Science Foundation of China (No.51475220), the State Foundation of Laboratory of Advanced Brazing Fill-er Metals&Technology (Zhengzhou Research Institute of Mechanical Engineering) (No.SKLABFMT-2015-03) and High Level Talent Plan of Jiangsu Normal University ( No.YQ2015002) . （No.51475220）

高技术通讯（英文版）

ISSN：1006-6748

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