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应用于Ka波段无线通信的发射前端模块设计与制造

陈守维 王启东 陈诚 李君 汪鑫 曹立强 陆原

现代电子技术2017,Vol.40Issue(21):39-42,4.
现代电子技术2017,Vol.40Issue(21):39-42,4.DOI:10.16652/j.issn.1004-373x.2017.21.010

应用于Ka波段无线通信的发射前端模块设计与制造

Design and manufacture of transmitting front-end module for wireless communication in Ka-band

陈守维 1王启东 2陈诚 1李君 2汪鑫 1曹立强 2陆原1

作者信息

  • 1. 中国科学院微电子研究所 系统封装与集成研发中心,北京 100029
  • 2. 华进半导体封装先导技术研发中心有限公司,江苏 无锡 214135
  • 折叠

摘要

Abstract

A transmitting front-end module for wireless communication in Ka-band is introduced,which is composed of the frequency mixer,microstrip filter,voltage-controlled oscillator(VCO),frequency multiplier and power amplifier. When the RF signals work at 27.4~28 GHz,the intermediate-frequency signal is fixed in 1 GHz. The simulation results show that the gain of the transmitting front-end is more than 10 dB,the transmitting power is 11.823 dBm,and the intermodulation signal is sup-pressed below 63 dBc while the signal works within the working frequency band. When all chips are working,the temperature simulation result show that the junction temperature of the chip is below 64 ℃. The test results show that,when the signal works within the working frequency,the insertion loss of the signal line in output terminal is less than 0.34 dB,the return loss is less than -20 dB,and the VCO output power after 8 frequency division is -10.66 dBm.

关键词

发射前端/温度/Ka波段/射频信号

Key words

transmitting front-end/temperature/Ka-band/RF signal

分类

信息技术与安全科学

引用本文复制引用

陈守维,王启东,陈诚,李君,汪鑫,曹立强,陆原..应用于Ka波段无线通信的发射前端模块设计与制造[J].现代电子技术,2017,40(21):39-42,4.

基金项目

国家高技术研究发展计划(863计划)(2015AA016904) (863计划)

国家科技重大专项(2013ZX02502)资助 (2013ZX02502)

现代电子技术

OA北大核心CSTPCD

1004-373X

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