电子学报2017，Vol.45Issue(9)：2098-2105,8.DOI:10.3969/j.issn.0372-2112.2017.09.007
基于Copula理论的芯片多元参数成品率估算方法
A Chip-Level Multi-parametric Yield Prediction Method Based on Copula Theory
摘要
Abstract
The previous approaches on parametric yield prediction are limited to either predicting parametric yield for single performance metric,or balanced optimizing several single-parametric yields.Consequently,these approaches may result in significant yield loss.In order to avoid the deficiency,this paper suggests a copula-based multi-parametric yield prediction method.First,the method models power and timing randomly and correlatively.Then,saddle point line sampling is applied to estimate their marginal distributions.Finally,according to copula theory,the multi-parametric yield is predicted.Experimental results demonstrate that comparing to Monte Carlo (MC) simulation,the proposed method has higher simulation efficiency,the simulation time is reduced by more than 12％.In addition,the relative errors of the results of this method and MC simulation in different ISCAS benchmark circuits are maintained at less than 9 ％,and under arbitrary performance limit,the proposed method can predict multi-parametric yield effectively.It provides the designer with yield information that considers multiple performance metrics simultaneously.关键词
可制造性设计/参数扰动/多元参数成品率估算/Copula理论/鞍点线抽样Key words
design for manufacturability/parameter variation/multi-parametric yield prediction/Copula theory/saddle point line sampling分类
信息技术与安全科学引用本文复制引用
李鑫,唐洁,肖甫..基于Copula理论的芯片多元参数成品率估算方法[J].电子学报,2017,45(9):2098-2105,8.基金项目
国家自然科学基金(No.61502234,No.71301081) （No.61502234,No.71301081）
江苏省自然科学基金(No.Bk20161072,No.Bk20150785,No.BK20130877) （No.Bk20161072,No.Bk20150785,No.BK20130877）
国家博士后基金(No.2014M551637) （No.2014M551637）
江苏省博士后基金(No.1401046C) （No.1401046C）
