铸造技术2017，Vol.38Issue(11)：2734-2736,2739,4.DOI:10.16410/j.issn1000-8365.2017.11.048
稀土元素Er对SnCu基无铅钎料组织与性能的影响
Influence of Rare Earth Er on Microstructures and Properties of SnCu Lead-free Solder
摘要
Abstract
The effect of rare earth Er on the microstructures and properties of Sn-0.7Cu lead-free solders were investigated.The microstructures of solders before and after adding rare earth elements were analyzed by XRD and SEM.The results show that the tensile strength and spreading area of solders firstly increase and then decrease,the total creep decrease and then increase with the increasing of rare earth content.That adding a moderate amount of rare earth elements can improve the tensile properties,spreading area,and creep properties of the solder.The optimum content of rare earth Er is around 0.1％.When the Er content is higher than 0.1％,the spreading area,the tensile strength and creep properties decrease obviously.Adding an appropriate amount of rare earth elements can also inhibit the growth of Cu6Sn5 and refine the solder关键词
稀土元素/Sn-0.7Cu/拉伸性能/铺展面积/蠕变性能/微观组织Key words
rare earth elements/Sn-0.7Cu/tensile strength/spreading area/creep properties/microstructures分类
矿业与冶金引用本文复制引用
廖春丽..稀土元素Er对SnCu基无铅钎料组织与性能的影响[J].铸造技术,2017,38(11):2734-2736,2739,4.基金项目
四川省教育厅自然科学基金项目资助(16ZB0465) （16ZB0465）
