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热残余应力对C/SiC复合材料界面剪切强度影响的有限元分析

李巾锭 吕哲 任成祖 陈光 董静川

材料科学与工程学报2017,Vol.35Issue(5):801-805,5.
材料科学与工程学报2017,Vol.35Issue(5):801-805,5.DOI:10.14136/j.cnki.issn 1673-2812.2017.05.022

热残余应力对C/SiC复合材料界面剪切强度影响的有限元分析

Finite Element Simulation of Interface Shear Strength of C/SiC Composites with Thermal Residual Stress

李巾锭 1吕哲 2任成祖 3陈光 1董静川2

作者信息

  • 1. 机构理论与装备设计教育部重点实验室,天津大学,天津300072
  • 2. 天津市装备设计与制造技术重点实验室,天津大学,天津300072
  • 3. 天津市特种设备监督检验技术研究院,天津300192
  • 折叠

摘要

Abstract

Considering the influence of residual stress on interface shear strength in the preparation process of C/SiC composite material,a two-dimensional axisymmetric model of single fiber push-out was established to study the interface shear strength of the C/SiC composites by finite element method.The interface shear stress and its related influencing factors in the push-out process were analyzed in the mesoscopic mechanical level.It was analyzed that the residual stress can cause damage to the interface,reduce the interface debonding load.The interface capacity was positively correlated with the thermal expansion coefficient,and negatively correlated with curing temperature.

关键词

热残余应力/C/SiC/复合材料/界面剪切强度

Key words

residual stress/C/SiC/composite/interface shear strength

分类

通用工业技术

引用本文复制引用

李巾锭,吕哲,任成祖,陈光,董静川..热残余应力对C/SiC复合材料界面剪切强度影响的有限元分析[J].材料科学与工程学报,2017,35(5):801-805,5.

基金项目

国家自然科学基金资助项目(51275346) (51275346)

教育部博士点基金资助项目(20110032110007) (20110032110007)

材料科学与工程学报

OA北大核心CSCDCSTPCD

1673-2812

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