电讯技术2017，Vol.57Issue(11)：1325-1329,5.DOI:10.3969/j.issn.1001-893x.2017.11.017
多层微波集成电路中微带线层间互连仿真
Simulation of Interconnection between Microstrip Lines in Multilayer Microwave Integrated Circuit
摘要
Abstract
Three microstrip interconnection circuit structures of vertical via interconnection,vertical strip in-terconnection, and coupling transition between the layers are introduced and simulated for solving the prob-lem of interconnection between microstrip lines in multilayer microwave intergration circuits ( MuMICs ) . The simulation is done by using the 3D electromagnetic simulation software HFSS. The simulated result shows that the return loss ( S11 ) and insertion loss ( S21 ) of the vertical via interconnection and the vertical strip interconnection are <-20 dB and >-1 dB in 0. 1~25 GHz,repectively, showing good connection per-formance. At the same time, the return loss ( S11 ) and insertion loss ( S21 ) of the coupling transition be-tween the layers are <-20 dB and >-1 dB in 20~68 GHz,respectively,which shows this method has the potential to be used in millimeter wave bands.关键词
多层微波集成电路/垂直通孔互连/垂直带条互连/层耦合过渡/S参数Key words
multilayer microwave integrated circuit ( MuMIC )/vertical via interconnection/vertical strip interconnection/coupling transition between the layers/S parameter分类
信息技术与安全科学引用本文复制引用
姬五胜,姬晓春,孙发坤,刘颖..多层微波集成电路中微带线层间互连仿真[J].电讯技术,2017,57(11):1325-1329,5.基金项目
天津职业技术师范大学2014年校级预研项目(KJY14-05) （KJY14-05）
