现代电子技术2017，Vol.40Issue(22)：137-141,5.DOI:10.16652/j.issn.1004-373x.2017.22.041
高速BGA封装与PCB差分互连结构的设计与优化
Design and optimization for high-speed BGA packaging and PCB differential interconnection structure
摘要
Abstract
With the constantly increase of the communication rate of the electronic systems,the signal integrity between BGA packaging and PCB interconnection area becomes particularly prominent. The high-speed BGA packaging and PCB differen-tial interconnection structure were designed and optimized. The specific influences of the packaging and PCB interconnection area differential wiring mode,signal distribution mode,S/G ratio,wiring layer and via hole stub on the transmission perfor-mance of the high-speed differential signal and crosstalk performance are analyzed emphatically. The full wave electromagnetic field simulation software CST is used to establish the 3D simulation model. The optimization method was verified with time-fre-quency domain simulation,which can improve the transmission performance of the high-speed differential signal,reduce the crosstalk among signals,and realize the perfect signal isolation.关键词
串扰/封装/差分过孔/信号完整性/CSTKey words
crosstalk/packaging/differential via hole/signal integrity/CST分类
信息技术与安全科学引用本文复制引用
高振斌,郝晓雪,李雅菲,王蒙军..高速BGA封装与PCB差分互连结构的设计与优化[J].现代电子技术,2017,40(22):137-141,5.基金项目
河北省高等学校高层次人才科学研究资助项目(GCC2014011) （GCC2014011）
