光学精密工程2017，Vol.25Issue(10)：2689-2696,8.DOI:10.3788/OPE.20172510.2689
硅片低损伤磨削砂轮及其磨削性能
Grinding wheel for low-damage grinding of silicon wafers and its grinding performance
摘要
Abstract
A new Soft Abrasive Grinding Wheel (SAGW) was developed for Chemo-mechanical Grind-ing (CMG) of silicon wafers to overcome the surface/subsurface damage of the silicon wafer machined by traditional ultra-precision grinding .According to the principle of the CMG and the material charac-teristics of monocrystalline silicon ,the SAGW took the cerium oxide (CeO2 ) as abrasive ,silicon diox-ide (SiO2 )as additive ,and the chlorine oxide magnesium as binding agent .The preparation process of the SAGW was investigated ,and its microstructure and composition were analyzed .By measuring the surface roughness ,surface microstructure and the surface/subsurface damage ,the grinding perform-ance of the SAGW was further explored .In the end ,fabricated silicon wafer with the same particle size by the SAGW ,Chemical Mechanical Polishing (CMP) and diamond grinding wheel was compared and analyzed .The results show that the surface roughness of the silicon wafer by the SAGW is less than 1 nm and its subsurface damage layer is about 30 nm in thickness ,which is comparable to that produced by the CMG and much better than that of the diamond wheel .This study demonstrates that the developed SAGW achieves the low-damage grinding of silicon wafers .关键词
单晶硅/软磨料砂轮/化学机械磨削/表面粗糙度/表面/亚表面损伤Key words
monocrystalline silicon/soft abrasive grinding wheel/chemo-mechanical grinding/surface roughness/surface/subsurface damage分类
信息技术与安全科学引用本文复制引用
王紫光,高尚,朱祥龙,董志刚,康仁科..硅片低损伤磨削砂轮及其磨削性能[J].光学精密工程,2017,25(10):2689-2696,8.基金项目
国家自然科学基金重大研究计划集成项目资助项目(No.91023019) （No.91023019）
国家自然科学基金创新研究群体资助项目(No.51621064) （No.51621064）
国家自然科学基金青年基金资助项目(No.51505063) （No.51505063）
国家科技重大专项(02专项)资助项目(No.2014ZX02504001) （02专项）
国家重点研发计划资助项目(No.2016YFB1102205) （No.2016YFB1102205）
