光学精密工程2017，Vol.25Issue(10)：2714-2724,11.DOI:10.3788/OPE.20172510.2714
RB-SiC亚表面损伤检测及其旋转 超声磨削亚表面损伤特征
Subsurface damage detection of RB-SiC and its subsurface damage characteristics in rotating ultrasonic grinding
摘要
Abstract
A cross-sectional polishing method (taking a silicon as foil or taking a polyester as foil ) and a bonded interface sectioning method were used to test the subsurface damage of RB-SiC (reaction bond-ed SiC)in rotary ultrasonic grinding (RUG) respectively .To determine the optimal test form ,four kinds of subsurface damage evaluation indexes ,namely average chipping layer depth ,maximum chip-ping layer depth ,average crack depth and maximum crack depth were used to analyze and compare the subsurface damages of RB-SiC in the RUG tested by the two methods mentioned above .The results show that the evaluation indexes from cross-sectional polishing method (the silicon as foil ) are 3 .30μm ,6 .59 μm ,8 .64 μm ,and 17 .44 μm ,those from the cross-sectional polishing method (the polyes-ter as foil) are 5 .71 μm ,14 .33 μm ,15 .36 μm ,and 54 .82 μm ,and those from the bonded interface sectioning method are 9 .19 μm ,19 .45μm ,13 .04 μm ,and 32 .20μm .It demonstrates that the cross-sectional polishing method (the silicon as foil) has the higher test accuracy ,and the detection result is more in line with the actual situation .Finally ,the paper summarizes subsurface damage characteris-tics of RB-SiC in the RUG .关键词
旋转超声磨削/反应烧结碳化硅(RB-SiC)材料/亚表面损伤/截面抛光法/界面黏接法Key words
rotary ultrasonic grinding/reaction Bonded SiC (RB-SiC )/subsurface damage/cross-sec-tional polishing/bonded interface sectioning分类
矿业与冶金引用本文复制引用
秦娜,郑亮,刘亚龙,孔春雷..RB-SiC亚表面损伤检测及其旋转 超声磨削亚表面损伤特征[J].光学精密工程,2017,25(10):2714-2724,11.基金项目
教育部重点实验室开放式基金资助项目(No.JMTZ201605) （No.JMTZ201605）
国家自然科学基金资助项目(No.51305369) （No.51305369）
中国博士后科学基金资助项目(No.2012M521708) （No.2012M521708）
高等学校博士学科点专项科研基金新教师类课题资助项目(No.20130184120007) （No.20130184120007）
中央高校基本科研业务费专项资金资助项目(No.SWJTU11CX023) （No.SWJTU11CX023）
