四川大学学报（自然科学版）2017，Vol.54Issue(6)：1217-1221,5.DOI:10.3969/j.issn.0490-6756.2017.06.015
基于多层板过孔互连结构的小型化微波整流电路设计
Design of a miniaturized rectifying circuit with a via-hole interconnected multilayer structure
摘要
Abstract
This article proposes a novel concept for constructing a microwave (MW) rectifying circuit by using a multilayer structure,aiming at reducing physical dimensions.Specifically,conductor layers in the multilayer structure are interconnected with an embedded via-hole.Then,an S-band rectifying circuit based on HSMS-282C Schottky diode is fabricated with the proposed multilayer structure for demonstration.The maximum MW-DC conversion efficiency of 73 ％ has been measured.In comparison with the conventional microstrip rectifying circuit,the proposed multilayer circuit shows a great reduction of physical dimensions and a very similar efficiency,which validates that the proposed circuit can reduce physical dimensions significantly without sacrificing the MW-DC conversion efficiency.关键词
整流电路/小型化/多层/过孔/转换效率Key words
Rectifying circuit/Miniaturized/Multilayer/Via-hole/Conversion efficiency分类
信息技术与安全科学引用本文复制引用
冯小平,黄卡玛..基于多层板过孔互连结构的小型化微波整流电路设计[J].四川大学学报（自然科学版）,2017,54(6):1217-1221,5.基金项目
国家重点基础研究发展“973计划”(2013CB328902,2013CB328905) （2013CB328902,2013CB328905）
