现代电子技术2017，Vol.40Issue(23)：34-37,4.DOI:10.16652/j.issn.1004-373x.2017.23.009
基于COMSOL Multiphysics的硅通孔信号传输性能分析
Signal transmission performance analysis of TSV based on COMSOL Multiphysics
摘要
Abstract
By analyzing the physical structure of signal-ground TSV,a scalable equivalent circuit model is put forward,and its electrical parameters such as capacitance and inductance are shown with mathematical expressions. The multi-physics coupling three-dimensional simulation software COMSOL Multiphysics is used to simulate the three-dimensional model of signal-ground TSV. The insertion loss obtained with COMSOL Multiphysics simulation analysis is compared with that obtained with mathematical model to verify the accuracy of the established equivalent circuit model. The influence of the signal-ground TSV′s radius,height and spacing on the insertion loss is analyzed. The results show that the transmission performance of the signal-ground TSV inter-connect structure becomes better with the increase of the radius,and worse with the increase of the height and spacing.关键词
信号-地硅通孔/等效电路模型/插入损耗/信号传输Key words
signal-ground TSV/equivalent circuit model/insertion loss/signal transmission分类
信息技术与安全科学引用本文复制引用
宣文静,来爱华,丁岩岩,李哲..基于COMSOL Multiphysics的硅通孔信号传输性能分析[J].现代电子技术,2017,40(23):34-37,4.基金项目
湖北省公安厅自主科研项目(hbst2014yycx03) （hbst2014yycx03）
