机械制造与自动化2017，Vol.46Issue(6)：17-19,24,4.DOI:10.19344/j.cnki.issn1671-5276.2017.06.005
雾化施液抛光中化学作用和机械作用的试验研究
Experimental Study of Chemical-Mechanical Effect in Atomizing Slurry Applied Polishing System
摘要
Abstract
This paper makes a study of the effect of chemical and mechanical action,such as polishing pressure,fog fluid flow,oxidant concentration and polishing pad rotating speed on the material removal rate.The result shows that the atomizing slurry applied polishing process is one of the combination of chemical and mechanical action.The material removal rate increases with one increase of polishing pressure,fog fluid flow,oxidant concentration or polishing pad rotating speed.This is the result of the chemical and mechanical action with each other.关键词
雾化施液/化学作用/机械作用/化学机械抛光(CMP)Key words
atomizing slurry/chemical action/mechanical action/chemical mechanical polishing (CMP)分类
信息技术与安全科学引用本文复制引用
孙发青,李庆忠..雾化施液抛光中化学作用和机械作用的试验研究[J].机械制造与自动化,2017,46(6):17-19,24,4.基金项目
国家自然科学基金资助项目(51175228) （51175228）
