工程科学与技术2018，Vol.50Issue(1)：157-163,7.DOI:10.15961/j.jsuese.201700592
电子机箱强迫风冷时PCB板局部表面传热系数的研究
Study of Local Surface Heat Transfer Coefficient of PCB Board in Electronic Chassis Under Forced Air-cooling
摘要
Abstract
The use of axial fans for cooling is one of the common ways for cooling the power electronic components.Through the analysis of the air flow velocity at the outlet section of axial fan,it can be inferred that the air flows is in a similar thread shape in the chassis.When the circuit board position is different,the local surface heat transfer coefficient (hx) is also different.Experimental analysis combined with simulation models were used to study the change law of hx.The experimental results were in good agreement with the simulation results,the results showed that the distribution law of the local surface heat transfer coefficient will change when the position of the circuit board is changed only in the vertical dir-ection.When the circuit board parallel cooling fan center axis placed horizontally,and the long side of the circuit board and the cooling fan center axis parallel,hxfirstly decreased and then increased along the length of the circuit board,the change of the vertical position of the circuit board mainly affected the variation law along the width of the circuit board,and with the distance from the hub center increased,the circuit board on the higher temperature along the width of the circuit board in the direction of the circuit board to move the edge.Which can provide an important basis for the installation of the cooling fan and the thermal design of the circuit board,and has great significance to the thermal design of electronic equipment.关键词
电子机箱/散热/强迫风冷/局部表面传热系数Key words
electronic chassis/heat dissipation/forced air-cooling/local heat transfer coefficient分类
机械制造引用本文复制引用
王秋晓,付晓艳,谭健,张光艳..电子机箱强迫风冷时PCB板局部表面传热系数的研究[J].工程科学与技术,2018,50(1):157-163,7.基金项目
国家自然科学基金资助项目(51175529) （51175529）
