电子器件2018，Vol.41Issue(1)：1-7,7.DOI:10.3969/j.issn.1005-9490.2018.01.001
温度循环对SMT焊点的影响分析
Analysis of Influence of Temperature Cycle on SMT Solder Joint
摘要
Abstract
With the wide application of surface mount technology in microelectronic circuits,the research on the reliability of solder joints is becoming more and more important,especially in low temperature thermal fatigue problems. The influence of temperature change on the failure of solder joint was found by the test of the solder joint of the printed circuit board and its experimental data at -40 ℃~125 ℃ and 0~100 ℃ temperature cycle. The average pull-out force decreases from 15 N to 5 N with the increase of the number of temperature cycles,and the faster the temperature difference variation is,the faster the tensile force decreases,that is,experiment 1 is significantly faster than that of experiment test 2 eventually reduced to 3.52 N. The reason for the analysis shows that after a long period of thermal cycling,the solder joint and the pad partially cracked,but did not lead to electrical failure. The solder joint is partially cracked so that the drawing process makes the solder fail in the case of applying a small force.关键词
微电子技术/SMT焊点/低周热循环实验/可靠性/温度Key words
microelectronic technology/SMT solder joint/low thermal cycle experiment/reliability/temperature分类
航空航天引用本文复制引用
王威,马喜宏,秦立君,何程..温度循环对SMT焊点的影响分析[J].电子器件,2018,41(1):1-7,7.基金项目
国家自然科学基金项目(51075374) （51075374）
