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离子注入和热退火工艺对应变Si材料应力影响研究

王颖

电子器件2018,Vol.41Issue(1):8-13,6.
电子器件2018,Vol.41Issue(1):8-13,6.DOI:10.3969/j.issn.1005-9490.2018.01.002

离子注入和热退火工艺对应变Si材料应力影响研究

Study on Ion Implantation and Thermal Annealing Effecting on the Stress of Strained Si

王颖1

作者信息

  • 1. 陕西学前师范学院,西安710100
  • 折叠

摘要

Abstract

Strained Si is used to propose a new way to extend the Moore law. The ion implantation and thermal annealing process affect on the stress of strained Si. An experiment scheme is designed used to study the relation among the stress of strained Si with the type、dose、energy of ion implantation and it with the temperature、time of thermal annealing. Results of Raman scattering show that stress of strained Si is hardly changed at the dose of ion implantation being less than 5×1014cm-2,and stress of strained Si is hardly changed within 1 000 ℃ and 60 min.

关键词

应变Si材料/离子注入/热退火/拉曼测试

Key words

strained Si material/ion implantation/thermal annealing/Raman scattering

分类

信息技术与安全科学

引用本文复制引用

王颖..离子注入和热退火工艺对应变Si材料应力影响研究[J].电子器件,2018,41(1):8-13,6.

电子器件

OA北大核心CSTPCD

1005-9490

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