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声学扫描技术在高可靠领域塑封器件检测中的应用

李永正 党炜 李昕昕 张泽明

电子器件2018,Vol.41Issue(1):19-24,6.
电子器件2018,Vol.41Issue(1):19-24,6.DOI:10.3969/j.issn.1005-9490.2018.01.004

声学扫描技术在高可靠领域塑封器件检测中的应用

Application of Scanning Acoustic Technology in the Detection of Plastic Encapsulated Device in the High Reliability Field

李永正 1党炜 1李昕昕 1张泽明1

作者信息

  • 1. 中国科学院空间应用工程与技术中心,北京100094
  • 折叠

摘要

Abstract

In order to improve the reliability of plastic encapsulated device in the high reliability field,it is necessary to use scanning acoustic microscopy(SAM)to detect defects such as internal delamination,void and crack in the plastic encapsulated device. The working mechanism and several main scanning modes of SAM were introduced. The characteristics and identification method of the typical defects in the plastic encapsulated device were pointed out based on comprehensive analysis of detection examples. Detection results would be of significant on the non-destructive testing(NDT)of the plastic encapsulated device by SAM.Furthermore,suggestions for improving the current detection standard of detecting plastic encapsulated device by SAM were put forward.

关键词

塑封器件/缺陷研究/超声波扫描/检测标准/可靠性

Key words

plastic encapsulated device/defect research/ultrasonic scanning/detection standard/reliability

分类

信息技术与安全科学

引用本文复制引用

李永正,党炜,李昕昕,张泽明..声学扫描技术在高可靠领域塑封器件检测中的应用[J].电子器件,2018,41(1):19-24,6.

基金项目

中国科学院青年创新促进专项基金项目(CASYI2014135) (CASYI2014135)

电子器件

OA北大核心CSTPCD

1005-9490

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