激光技术2018，Vol.42Issue(2)：176-180,5.DOI:10.7510/jgjs.issn.1001-3806.2018.02.007
激光改性硅酸盐玻璃表面局域制备金属铜层
Selective preparation of metal copper layer on silicate glass by laser surface modification
摘要
Abstract
In order to realize the metallization of ordinary silicate glass surface,roughness and activation were carried out by pulse ultraviolet (355nm wavelength) laser etching. The conductive copper layer was locally fabricated on the surface with the combination of chemical plating. The influence of laser processing parameters on micro topography,roughness and etching depth of glass surface was investigated. Palladium was successfully introduced into glass surface. The results show that, at the first scanning (UV laser scanning rate of 200mm/s, pulse frequency of 100kHz, energy density of 27J/cm2~37J/cm2and filling interval of about 10μm),the etched depth of glass surface is between 25μm~35μm and roughness Raof the etching region is between 6μm~7μm. Glass won't crack at this time. At the second scanning (energy density between 9J/cm2~11J/cm2and the remaining unchanged parameters),chemical copper plating was realized by the introduction of palladium. At this point,the average bonding strength between copper layer and glass can be above 10MPa and volume resistivity of copper layer can reach 10 -6Ω·cm orders of magnitude. The glass surface metallization process is with local selectivity, no needed mask, low cost, high bonding strength and good electrical conductivity.关键词
激光技术/表面改性/脉冲紫外激光刻蚀/硅酸盐玻璃Key words
laser technique/surface modification/pulsed ultraviolet laser etching/silicate glass分类
化学化工引用本文复制引用
侯田江,艾骏,刘建国,曾晓雁..激光改性硅酸盐玻璃表面局域制备金属铜层[J].激光技术,2018,42(2):176-180,5.基金项目
国家自然科学基金面上资助项目(51473058) （51473058）
