金刚石与磨料磨具工程2017，Vol.37Issue(5)：41-44,49,5.DOI:10.13394/j.cnki.jgszz.2017.5.0007
线速度对金刚石线锯及硅片表面质量的影响
Influence of wire speed on diamond wire saw and surface quality of silicon wafer
李宏达 1秦军存 1邢旭 1明兆坤1
作者信息
- 1. 青岛高测科技股份有限公司,山东青岛266000
- 折叠
摘要
Abstract
The wear of wire and the surface quality of silicon wafer under different wire speeds were studied.The micro and quantitative analysis of the used wire and silicon wafer was investigated by SEM and roughness instrument.The results showed that the smaller the wear of diamond wire with the wire speed increasing from 3.5 μm to 2.5 μm;;diamond wire cutting silicon materials for plastic and brittle mixed mode of removal of silicon surface profile showed a continuous groove,accompanied by a large number of scratches and pits,with the wire speed increasing the surface roughness of silicon wafer was gradually decreased,Ra、Rz and Rt decreased by 33.7％、37.8％、45.6％,the number of surface pits also gradually reduced.关键词
金刚石线锯/多线切割/硅片/线速度Key words
diamond wire/multi-wire saw/silicon wafer/wire speed分类
矿业与冶金引用本文复制引用
李宏达,秦军存,邢旭,明兆坤..线速度对金刚石线锯及硅片表面质量的影响[J].金刚石与磨料磨具工程,2017,37(5):41-44,49,5.
