人工晶体学报2018，Vol.47Issue(1)：225-230,6.
阳极氧化铝基板的制备及在LED散热领域的应用
Preparation of Anodic Alumina Substrate and Its Application in LED Heat Dissipation
秦典成 1陈爱兵 1肖永龙 1梁建北 1黄奕钊1
作者信息
- 1. 乐健科技(珠海)有限公司,广东省LED封装散热基板工程技术研究中心,珠海519180
- 折叠
摘要
Abstract
The regular anodic alumina substrate was prepared using anodization technique, and the selective anodic alumina substrate was also fabricated in the same way with the application of graphic transfer technique.The microscopic morphology of interface between anodic oxide film and aluminium alloy under the condition of sudden temperature change has been studied by thermal shock test using scanning electron microscope.A comparison of heat dissipation effect between these anodic alumina substrates and MCPCB in LEDs'application has also been researched using junction temperature tester, integrating sphere system,power meter and semiconductor refrigeration temperature control platform.As a result, it has been found that when the temperature went from -55 ℃ up to 125 ℃, no crack happened in the Anodic oxide film and the interface between anodic oxide film and aluminium alloy exhibited a sound combination after 1000 cycles,suggesting a good bonding strength on the condition of drastic temperature change.Meanwhile, as for the LED with 3 W driving power, the junction temperatures were 46.5 ℃,42.03 ℃and 38.52 ℃,and the thermal resistances were 9.29 ℃/W,7. 49 ℃/W and 5.85 ℃/W when the traditional MCPCB, regular anodic alumina substrate and selective anodic alumina substrate came into use respectively.关键词
选择性阳极氧化/LED模组/结温/热阻Key words
selective anodic/LED module/junction temperature/thermal resistance引用本文复制引用
秦典成,陈爱兵,肖永龙,梁建北,黄奕钊..阳极氧化铝基板的制备及在LED散热领域的应用[J].人工晶体学报,2018,47(1):225-230,6.
