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The stability of a novel weakly alkaline slurry of copper interconnection CMP for GLSI

Caihong Yao Chenwei Wang Xinhuan Niu Yan Wang Shengjun Tian Zichao Jiang Yuling Liu

半导体学报（英文版）2018，Vol.39Issue(2)：78-85,8.

半导体学报（英文版）2018，Vol.39Issue(2)：78-85,8.DOI:10.1088/1674-4926/39/2/026002

The stability of a novel weakly alkaline slurry of copper interconnection CMP for GLSI

Caihong Yao ¹Chenwei Wang ²Xinhuan Niu ¹Yan Wang ²Shengjun Tian ¹Zichao Jiang ²Yuling Liu¹

作者信息

1. School of Electronics and Information Engineering, Hebei University of Technology, Tianjin 300130, China
2. Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300130, China
折叠

摘要

关键词

stability/weakly alkaline slurry/CMP/copper interconnection

Key words

stability/weakly alkaline slurry/CMP/copper interconnection

引用本文复制引用

Caihong Yao,Chenwei Wang,Xinhuan Niu,Yan Wang,Shengjun Tian,Zichao Jiang,Yuling Liu..The stability of a novel weakly alkaline slurry of copper interconnection CMP for GLSI[J].半导体学报（英文版）,2018,39(2):78-85,8.

基金项目

Project supported by the Major National Science and Technology Special Projects (No.2016ZX02301003-004-007),the Professional Degree Teaching Case Foundation of Hebei Province,China (No.KCJSZ2017008),the Natural Science Foundation of Hebei Province,China (No.F2015202267),and the Natural Science Foundation of Tianjin,China (No.16JCYBJC16100). （No.2016ZX02301003-004-007）

半导体学报（英文版）

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ISSN：1674-4926

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