中国电机工程学报2018，Vol.38Issue(5)：1553-1561,后插30,10.DOI:10.13334/j.0258-8013.pcsee.172023
大气压等离子体射流Cu表面改性抑制微放电
Surface Modification of Cu by Atmospheric Pressure Plasma Jet for Micro Discharge Inhibition
摘要
Abstract
The presence of conductor micro-defects may distort the local electric field and cause micro discharge, which seriously affects the insulation safety of the transmission equipment. In this paper, we presented a method for suppressing local micro discharges by plasma deposited films on the conductor surface. The surface of Cu was modified by atmospheric pressure plasma jet excited by AC power supply. TiO2 film was deposited on Cu surface by plasma enhanced chemical vapor deposition using TiCl4 as titanium precursor. The effects of air addition and substrate temperature on the discharge characteristics and the qualities of the deposited films were also discussed. The results show that two current pulse appear during positive half voltage period after air addition, and the current amplitude become smaller. The optimal treatment condition is obtained with substrate heating to 100℃ and air gas flow rate of 40sccm. And in this case, Ti element and O element reached the highest intensity of 18.6％ and 43.5％ respectively.Furthermore, the film surface microstructure is more uniform and the bonding was more densely. The thickness of film is 349nm after 2 minutes deposition. The film work function test shows that compared with the untreated Cu, the surface work function after deposition has been improved from 4.65eV to 4.87eV. The distribution of the electric field simulation results show that after deposition of film, the maximum field strength at the defect is reduced from 1.4×106V/m to 9.89×105V/m, which has a certain positive effect on the electric field distortion.关键词
大气压等离子体射流/表面改性/四氯化钛/二氧化钛薄膜/微放电Key words
atmospheric pressure plasma jet/surface modification/TiCl4/TiO2 film/micro discharge分类
信息技术与安全科学引用本文复制引用
崔超超,章程,任成燕,高远,陈根永,邵涛..大气压等离子体射流Cu表面改性抑制微放电[J].中国电机工程学报,2018,38(5):1553-1561,后插30,10.基金项目
国家自然科学基金项目(11575194) （11575194）
国家重点基础研究发展计划项目(973项目)(2014CB239505-3). Project Supported by National Natural Science Foundation of China (11575194) （973项目）
The National Basic Research Program (973 Program) (2014CB239505-3). （973 Program）
