液晶与显示2018，Vol.33Issue(3)：188-194,7.DOI:10.3788/YJYXS20183303.0188
基于ANSYS液晶玻璃基板的应力分析
Stress analysis of LCD glass substrate based on ANSYS
刘洋 1胡亮 1洪性坤 1朱载荣 1桂继维 1陈栋 1王维维 1聂学政 1章亭1
作者信息
- 1. 福州京东方光电科技有限公司,福建福州350000
- 折叠
摘要
Abstract
Structural stress and thermal stress of LCD glass substrate absorbed by quartz-rod was studied by numerical method.The change of glass structure stress and thermal stress of different ma-terial and different thickness glass was discussed.The results of structural stress analysis show that the maximum deflection,equivalent stress and bending stress are in the middle of glass.When the thickness of the substrate increases,the maximum stress value decreases significantly.The thermal stress analysis shows that when the glass substrate has atemperature gradient,the glass substrate is more deflected with the larger heated area.With the decrease of the temperature,the deflection,e-quivalent stress and bending stress of the glass substrate are increased first,then the stress of the substrate is significant in the process of cooling.As the temperature increases after the first decreases, the deflection,equivalent stress and bending stress of glass substrate firstly increases then decreases, and the substrate stress changes significantly in the process,equivalent stress changes most,bending compressive stress changes smaller,bending tensile stress changes smallest.The maximum values of the equivalent stress and bending stress of glass substrate are 44.8 Mpa and 5.79 Mpa respectively. Reducing the temperature gradient and the heating value of the glass substrate can effectively prevent the glass cracking.关键词
ANSYS/玻璃基板/结构应力/热应力Key words
ANSYS/glass substrate/structural stress/thermal stress分类
数理科学引用本文复制引用
刘洋,胡亮,洪性坤,朱载荣,桂继维,陈栋,王维维,聂学政,章亭..基于ANSYS液晶玻璃基板的应力分析[J].液晶与显示,2018,33(3):188-194,7.
