重庆理工大学学报（自然科学版）2018，Vol.32Issue(4)：119-126,8.DOI:10.3969/j.issn.1674-8425(z).2018.04.019
温度梯度对Cu/Sn/Cu微焊点界面反应和剪切强度的影响
Effect of Temperature Gradient on Interfacial Reaction and Mechanical Properties of Cu/Sn/Cu Solder Joints
摘要
Abstract
Miniaturization,multi-functional electronic products on the micro-interconnect solder joint size requirements become more stringent.The size of the micro-interconnect solder joints is getting smaller and smaller,therefore,the growing current density and severe Joule heat problem results in a higher temperature gradient in the micro-interconnect solder joints.The temperature gradient will induce the thermal migration of the metal atoms,causing serious reliability problems.In this paper, the thermal migration behavior of metal atoms due to temperature gradient is analyzed based on the study of Cu/Sn/Cu micro-interconnecting solder joints in recent years.The effects of temperature gradient on micro-interconnection reaction and mechanical properties are summarized.The experimental results show that the Cu/Sn/Cu solder joints migrate at 200 ℃-20 ℃ and 200 ℃-0 ℃,and the heat transfer effect is increasing with time.The thickness of the IMC layer of the 100 μm solder joint is significantly thicker than 300 μm solder joints at the same temperature gradient and at the same time for two different width solder joints.The thickness of the IMC layer is increased and the mechanical properties are significantly reduced for two different thickness solder joints,with the same temperature gradient and the same time.The migration heat of the two solder joints under different temperature gradient is calculated,which shows that when the forced cooling is a great temperature gradient for the solder joint,the Cu atoms can be diffusion in solid Sn.关键词
温度梯度/迁移热/界面反应/IMC/剪切强度Key words
temperature gradient/migration heat/interface reaction/IMC/mechanical strength分类
金属材料引用本文复制引用
张春红,江馨,岳精雷,王渝,蒋志高,杨栋华,甘贵生,刘歆..温度梯度对Cu/Sn/Cu微焊点界面反应和剪切强度的影响[J].重庆理工大学学报（自然科学版）,2018,32(4):119-126,8.基金项目
国家自然科学基金面上项目(61774066) （61774066）
重庆市科委基础与前沿研究项目(cstc2016jcyjA0226) （cstc2016jcyjA0226）
重庆市教委科学技术研究项目(KJ1600912,KJ1600943) （KJ1600912,KJ1600943）
广东省科技计划项目(2013B090600031) （2013B090600031）
重庆理工大学实验技术开发基金资助项目(SK201708) （SK201708）
