现代电子技术2018，Vol.41Issue(10)：19-23,27,6.DOI:10.16652/j.issn.1004⁃373x.2018.10.005
热与随机振动对车载电路板的影响研究
Research on influence of heat and random vibration on vehicle-mounted circuit board
摘要
Abstract
The combination influence of motor heat and vibration on the vehicle-mounted circuit board components during the car moving process is studied. The finite element software ANSYS is adopted to construct the model for the circuit board of motor module and analyze the thermal stress of temperature field. The stress results are imported for modal analysis and random vibration analysis. The modal and random vibration results of the circuit board under normal temperature are compared with that of heated circuit board. The results show that the inherent frequency and the stiffness of the heated circuit board increase while its deformation reduces. In addition,the statistical stress value of the maximum stress point for the circuit board component reaches the highest at the eighth order frequency,and the power spectrum curve of heated circuit board wholly moves backward in comparison with that of the circuit board under normal temperature. By means of random fatigue calculation,the structure of the circuit board can meet the fatigue requirement under the influence of heat and vibration.关键词
车载电路板/热应力/ANSYS/模态分析/随机振动/疲劳计算Key words
vehicle-mounted circuit board/thermal stress/ANSYS/modal analysis/random vibration/fatigue calculation分类
信息技术与安全科学引用本文复制引用
周嘉诚,刘芳,燕怒..热与随机振动对车载电路板的影响研究[J].现代电子技术,2018,41(10):19-23,27,6.基金项目
湖北省教育厅优秀中青年科技创新团队计划项目(T201607) （T201607）
湖北省教育厅科学研究计划青年人才项目资助(Q20141608) （Q20141608）
国家自然科学基金青年项目资助(11102141)Project Supported by Scientific and Technological Innovation Team Plan Project of Hubei Provincial Department of Education for Outstanding Youth and Middle Aged Persons(T201607),Scientific Research Plan of Hubei Provincial Department of Education for Youth Talents(Q20141608),National Natural Science Foundation of China for Youth(11102141) （11102141）
