光学精密工程2018，Vol.26Issue(3)：632-639,8.DOI:10.3788/OPE.20182603.0632
反应烧结SiC陶瓷脆性去除特征及刻划力波动行为
Removal characteristics and fluctuation behavior of cutting force during scratch process of RB-SiC ceramics
摘要
Abstract
This paper aims to explore the brittle fracture characteristics and fluctuation behavior of cutting force during scratch process of RB-SiC with different scratch depth and indenter shapes.The diamond Berkvoich indenter with 400 nm and conical indenter with 8.7 um were used to conduct experiments under constant scratch depth mode.Then,the surface morphologies and brittle fracture behavior were observed with a scan electron microscopy (SEM).Finally,Daubechies wavelet was adopted to decompose the lateral and tangential forces,and the relationship between different detail signal/decompose signal and damage types were given.The results show that with the increasing of scratch depth,plastic extrusion,micro fracture and large area fracture are coexist when conical indenter is used.Besides,the degree of fracture is more serious and cutting force signal energy spread from low-frequency to the whole frequency with the decrease of indenter radius and the energy of low-frequency band energy gradually occupied the dominates position.Surface and margin microfracture make the dominate contribution to the detail signal of cutting force.Scratching force fluctuation energy is mainly come from the structure difference and defects of RB-SiC which caused mass crushing,and increased with scratch depth.关键词
RBSiC/脆性断裂/小波分析/刻划力/玻氏压头/圆锥压头Key words
RB-SiC/brittle fracture/wavelet analysis/scratch force/Berkvoich indenter/conical indenter分类
天文与地球科学引用本文复制引用
李志鹏,张飞虎,孟彬彬..反应烧结SiC陶瓷脆性去除特征及刻划力波动行为[J].光学精密工程,2018,26(3):632-639,8.基金项目
国家973重点基础研究发展计划资助项目(No.2011CB013202) （No.2011CB013202）
国家重点研发计划资助项目(No.2016YFB1102204) （No.2016YFB1102204）
