机械科学与技术2018，Vol.37Issue(5)：792-796,5.DOI:10.13433/j.cnki.1003-8728.2018.0520
PDMS基体等离子法键合工艺及效果分析
Analysis of Plasma Bonding Process and Effect for PDMS
摘要
Abstract
To explore the bonding effect of the polydimethylsiloxane (PDMS) substrate handled with different bonding time and bonding pressure after different process parameters of the plasma treatment.The three factor-four level-orthogonal tests and contrast tests was designed.The experimental results indicate that the sequence of the factors which organized by their influence is of:air flow rate ＞ treatment time ＞ radio frequency (RF) power.The parameters to get rapid irreversible bonding (Bonding 5 min) is:400 W,2.5 L/min,2 min.Under the middle or high RF power (300 W or higher),the bonding effects can meet the requirement with 10 h bonding.Under the low RF power (200 W or lower),the bonding effect can not meet the requirement after 24 hours.The bonding effect is significantly improved when the bonding pressure is more than 0.4 MPa.关键词
等离子法/正交试验/不可逆键合/键合效果Key words
plasma treatment/orthogonal tests/irreversible bonding/bonding effect分类
机械制造引用本文复制引用
崔东旭,张若愚,俞天,戴隆超..PDMS基体等离子法键合工艺及效果分析[J].机械科学与技术,2018,37(5):792-796,5.基金项目
国家自然科学基金项目(11372269)资助 （11372269）
