金刚石与磨料磨具工程2018，Vol.38Issue(1)：89-93,97,6.DOI:10.13394/j.cnki.jgszz.2018.1.0016
动态磁场集群磁流变抛光加工机理及试验研究
Mechanism and experimental study of cluster magnetorheological polishing with dynamic magnetic
摘要
Abstract
The machining mechanism of cluster magnetorheological plane finishing and the action mechanism of dynamic magnetic fields were analyzed.The magnetorheological polishing experiments of dynamic magnetic field on silicon substrate were carried out.Results show that the dynamic magnetic field can make the distorted polishing pad self-repair in time,and that the abrasives have frequent dynamic behavior.It overcomes the shortcomings of distorted pads repairing and abrasive agglomeration under the static magnetic field.The material removal process is stable and the polishing effect is better.Under the dynamic magnetic fields,different polishing methods make big different effect on the polishing results.In multi workpieces synchronous polishing,the high speed self rotation of the large size tool head makes the workpieces have higher line speed,and the abrasives has a stronger effect on the surface defect removal of the mono crystalline silicon substrate.After 5 h polishing,the surface of the silicon wafer is super smooth,and its roughness Ra is reduced from 0.48 μm to 3.3 nm.关键词
动态磁场/集群磁流变/平面抛光/单晶硅基片/表面粗糙度Key words
dynamic magnetic field/cluster magnetorheological effect/plane polishing/monocrystalline silicon substrate/surface roughness分类
矿业与冶金引用本文复制引用
郭明亮,阎秋生,潘继生,肖晓兰..动态磁场集群磁流变抛光加工机理及试验研究[J].金刚石与磨料磨具工程,2018,38(1):89-93,97,6.基金项目
广东省自然科学基金重点项目(2015A030311044) （2015A030311044）
广东省科技计划项目(2016A010102014). （2016A010102014）
