林业工程学报2018，Vol.3Issue(3)：63-67,5.DOI:10.13360/j.issn.2096-1359.2018.03.011
双酚A环氧树脂/双氰胺/2-甲基咪唑体系研究
Study on an bisphenol epoxy resin/dicyandiamide/2-MI system
摘要
Abstract
Most epoxy resins cure under high temperature, which limit their applications. An epoxy resin cured at medi-um temperature was developed in this study, and in this resin system, dicyandiamide ( DCD) and 2-methyl imidazole ( 2-MI) were chosen as the curing agent and accelerant, respectively. The effect of the addition of 2-MI in the DCD/EP system on the physical and mechanical properties of the modified epoxy resin was investigated. The EP/2-MI/DCD modified epoxy resin composites were prepared by a method combined of solvent exchanging and melt mixing. The mechanical properties of the resin composite were investigated by tensile, and impact test and thermal stability of the composites were studied by using thermogravimetric analysis ( TGA) . The fractured surfaces of the cured samples were investigated by the scanning electron microscopy ( SEM) to characterize its morphological structure. The results showed that the impact and tensile strength of the composites both increased with the 2-MI addition. The optimal a-mount of 2-MI in the epoxy adhesives was between 0.4 wt％ and 0.5 wt％, at which the tensile strength reached the highest value of 72.54 MPa (2-MI addition was 0.4 wt％), and the maximum impact strength was up to 14.99 kJ/m2 ( 2-MI addition was 0.5 wt％) . Meanwhile, the toughness of the dipping laminated plate also increased along with the addition of 2-MI. The results of the SEM analysis showed that the modified epoxy resin was more firm and compact, indicated that the properties of the modified epoxy resin was improved. However, the results of thermogravimetric a-nalysis showed that the addition of 2-MI had no significant effect on the thermal stability of the resin composite. The addition of 2-MI might form a three-dimensional network structure in the epoxy resin macro-molecule when the bis-phenol-A epoxy resin cured, which thus gave the epoxy resin a stable structure with infusible and insoluble properties, as well as a considerable thermal stability and heat resistance.关键词
2-甲基咪唑/E-51环氧树脂/改性/力学性能/热重分析/扫描电镜Key words
2-methylimidazole/E-51 epoxy resin/modify/mechanical property/TGA/SEM分类
化学化工引用本文复制引用
何星蔚,张金杰,王恒旭,傅深渊,庞久寅,王发鹏..双酚A环氧树脂/双氰胺/2-甲基咪唑体系研究[J].林业工程学报,2018,3(3):63-67,5.基金项目
国家自然科学基金(31270589). （31270589）
