光学精密工程2018，Vol.26Issue(5)：1133-1139,7.DOI:10.3788/OPE.20182605.1133
无源MEMS压力开关的设计与制备
Design and fabrication of passive MEMS pressure switch
摘要
Abstract
In order to overcome the shortcomings of traditional mechanical and electronic pressure switches ,such as the production process is complex and it is difficult to integrate with the follow-up circuit ,bulky and so on ,the design and preparation of passive MEMS pressure switch were developed by using glass frit encapsulation technology with metal lead coverage in this paper . The overall structure of the passive MEMS pressure switch was designed to include the pressure sensitive film , the silicon island and the upper electrode on the silicon cover and the micro-barrier bumps ,the glass paste and the lower electrode on the glass substrate .The key dimensions of pressure sensitive film , silicon islands and upper and lower electrodes were optimized by simulation .After three wet etching processes ,double barrier bump ,silicon island and pressure sensitive film were fabricated .The silicon cover ,the glass substrate and the metal lead were then bonded together as a whole by glass frit thermal-pressure bonding process .The results show that the height of the double-barrier bumps and the thickness of the pressure-sensitive film are well controlled at 8 μm and 50 μm ,respectively .And the threshold pressure of the MEMS pressure switch is 125 kPa .关键词
MEMS压力开关/结构设计/湿法腐蚀/玻璃浆料封装Key words
Micro-Electro-Mechanical System (MEMS) pressure switch/structural design/wet etching/glass frit encapsulation technology分类
机械制造引用本文复制引用
刘益芳,陈丹儿,戴婷婷..无源MEMS压力开关的设计与制备[J].光学精密工程,2018,26(5):1133-1139,7.基金项目
国家自然科学基金资助项目(No .61404111) （No .61404111）
