宇航材料工艺2018，Vol.48Issue(3)：82-85,4.DOI:10.12044/j.issn.1007-2330.2018.03.017
短引脚PGA选择性波峰焊工艺技术
Selective Wave Soldering Processing Technology of Short-Lead PGA
杜爽 1杨京伟 1齐林 1田小梅 1赵亚飞1
作者信息
摘要
Abstract
For the PGA package device leads in the assembly process is too short,the short-lead PGA is tested by selective wave soldering after analyzing the three main welding methods to optimize the welding process parameters,and the welding quality is discussed by looking at the appearance,X-ray and metallographic.The conclusion can be made that after visual inspection and X-rays inspection,no obvious solder joints defects are found in the short-lead PGA solder joints by selective wave soldering.The metallographic map of the solder joints show good welding at the joint,and meet the requirements of qualified intermetallic compound thickness.The selective wave soldering process method can realize short-lead PGA welding and has certain application value.关键词
短引脚PGA/选择性波峰焊/工艺参数/焊点质量Key words
Short-lead PGA/Selective wave soldering/Process parameters/Solder joint quality分类
信息技术与安全科学引用本文复制引用
杜爽,杨京伟,齐林,田小梅,赵亚飞..短引脚PGA选择性波峰焊工艺技术[J].宇航材料工艺,2018,48(3):82-85,4.
