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单硅片单面硅微机械加工的热温差式流量传感器

薛丹 王家畴 李昕欣

传感技术学报2018,Vol.31Issue(6):821-825,5.
传感技术学报2018,Vol.31Issue(6):821-825,5.DOI:10.3969/j.issn.1004-1699.2018.06.001

单硅片单面硅微机械加工的热温差式流量传感器

The Single-Wafer Single-Side Silicon Bulk-Micromachined Thermal Flow Sensor

薛丹 1王家畴 2李昕欣1

作者信息

  • 1. 中国科学院上海微系统与信息技术研究所,上海200050
  • 2. 中国科学院大学,北京100049
  • 折叠

摘要

Abstract

A novel thermal flow sensor is proposed and developed,which is fabricated only from the front side of(111)sil-icon wafer through bulk-micromachining process. COMSOL Multiphysics software is employed to optimize some sensitive parameters,which gives a promise to isolating the generating heat from the silicon wafer totally and reduces the device thermal loss at utmost. Furthermore,being benefit from the MEMS Micro-openings Inter-etch&Sealing(MIS)process,the fabricated sensor chip size is as small as 0.7 mm×0.7 mm. The testing results show that the flow sensor achieves an ultra-high normalized sensitivity of 107.88 mV/(m/s)/W with respect to heating power and gain for nitrogen gas flow. Further-more,the response time of the sensor is 1.53 ms and the accuracy is ±4%.

关键词

热温差式流量传感器/热隔离/单硅片单面硅微机械加工/仿真分析

Key words

thermal flow sensor/thermal isolating/single-side silicon bulk-micromaching/simulation analysis

分类

信息技术与安全科学

引用本文复制引用

薛丹,王家畴,李昕欣..单硅片单面硅微机械加工的热温差式流量传感器[J].传感技术学报,2018,31(6):821-825,5.

基金项目

国家自然科学基金面上项目(61674160) (61674160)

传感技术学报

OA北大核心CSCDCSTPCD

1004-1699

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