电子学报2018，Vol.46Issue(3)：629-635,7.DOI:10.3969/j.issn.0372-2112.2018.03.017
相邻层冗余共享的三维存储器成品率优化方法
Yield Optimization Technique for Three Dimensional Memory Based on Redundancy Sharing Among Adjacent Layers
摘要
Abstract
Memory dies stacking strategy and redundancy sharing structure have great effects on the yield of three-dimensional (3D) memory. To improve 3D memory yield and reduce the number of TSVs consumed by row and column redundancies, this paper proposed a redundancy sharing structure among adjacent layers. In the proposed sharing structure, the redundancies in each layer not only can be used to repair the faults in the layer where the redundancies reside, but also can be utilized by adjacent layers. On the basis of this proposed structure, a new die-stacking strategy is presented. Through formularized selection conditions for memory dies, the presented strategy can choose suitable memory dies to stack 3D memory. In this way, the row and column redundancies are fully used. Experimental results illustrate the proposed redundancy sharing structure and die-stacking strategy can effectively improve 3D memory yield and reduce the number of TSVs consumed by spare rows and columns.关键词
三维存储器/冗余共享/成品率/存储裸片Key words
3D memory/redundancy sharing/yield/memory dies分类
信息技术与安全科学引用本文复制引用
刘军,朱承强,吴玺,王伟,任福继..相邻层冗余共享的三维存储器成品率优化方法[J].电子学报,2018,46(3):629-635,7.基金项目
国家自然科学基金项目(No.61432004,No.61306049, No.61204046,No.61474035) （No.61432004,No.61306049, No.61204046,No.61474035）
