激光技术2018，Vol.42Issue(4)：567-571,5.DOI:10.7510/jgjs.issn.1001-3806.2018.04.025
激光等离子体对硅表面微纳粒子除去机理研究
Study on removal mechanism of micro-/nano-particles on silicon surface by laser plasma
罗锦锋 1宋世军 1王平秋 2刘全喜2
作者信息
- 1. 信阳职业技术学院汽车与机电工程学院,信阳464000
- 2. 西南技术物理研究所,成都610041
- 折叠
摘要
Abstract
Laser-induced plasma has shown increasing potential in removing micro-/nano-particles stuck onto the surface of precise components in nano-science and nano-technology.In order to study the removal mechanism of the micro-/nano-particles,silicon surfaces were cleaned by means of nanosecond laser plasma,during which the removal results was observed and then the optimized conditions for laser plasma to flush the silicon surface was recommended.The results show that plasma radiates out wide-spectrum light,whose ultraviolet short wave accelerates the ionization of surrounding air,increases the volume of plasma and increase the temperature of base and particle effectively.Because of thermal expansion difference between the base and particles,the particles are peeled from the base easily.At the same time,the high pressure shock waves up to GPa are formed resulting from the expansion and diffusion of plasma to the surrounding area.It can overcome van Edward force between the particles and the substrate and remove the micro-/nano-particles.Especially,the removal effect of the particle size larger than 0.5μm is more obvious.During the actual removal process,the distance from the plasma to the base should be between 0.2mm and 2mm.The distance can ensure the effective removal of the particles and cause no damage to the base.The effect of laser plasma on the removal of particles is obvious and it is the combined effect of the radiation effect and the shock wave effect of the plasma.关键词
激光技术/激光等离子体/辐射光谱/微纳粒子/表面清洗Key words
laser technique/laser-induced plasma/radiation spectrum/micro-/nano-particle/surface cleaning分类
数理科学引用本文复制引用
罗锦锋,宋世军,王平秋,刘全喜..激光等离子体对硅表面微纳粒子除去机理研究[J].激光技术,2018,42(4):567-571,5.
