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Reliability testing of a 3D encapsulated VHF MEMS resonator

Fengxiang Wang Quan Yuan Xiao Kan Jicong Zhao Zeji Chen Jinling Yang Fuhua Yang

半导体学报（英文版）2018，Vol.39Issue(10)：64-67,4.

半导体学报（英文版）2018，Vol.39Issue(10)：64-67,4.DOI:10.1088/1674-4926/39/10/104008

Reliability testing of a 3D encapsulated VHF MEMS resonator

Fengxiang Wang ¹Quan Yuan ²Xiao Kan ³Jicong Zhao ¹Zeji Chen ²Jinling Yang ¹Fuhua Yang²

作者信息

1. Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
2. University of Chinese Academy of Sciences, Beijing 100049, China
3. State Key Laboratory of Transducer Technology, Shanghai 200050, China
折叠

摘要

关键词

3D encapsulation/VHF disk resonator/frequency stability/parasitic effect

Key words

3D encapsulation/VHF disk resonator/frequency stability/parasitic effect

引用本文复制引用

Fengxiang Wang,Quan Yuan,Xiao Kan,Jicong Zhao,Zeji Chen,Jinling Yang,Fuhua Yang..Reliability testing of a 3D encapsulated VHF MEMS resonator[J].半导体学报（英文版）,2018,39(10):64-67,4.

基金项目

Project supported by the National Key Research and Development Program of China (No.2017YFB0405400),the National Natural Science Foundation of China (Nos.61234007,61734007,61404136,61704166),and the Key Research Program of Frontier Science of CAS (No.QYZDY-SSW-JSC004). （No.2017YFB0405400）

半导体学报（英文版）

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ISSN：1674-4926

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