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双层矩形微板谐振器件中热弹性阻尼机理研究

左万里 黄家瀚

传感技术学报2019,Vol.32Issue(1):50-56,7.
传感技术学报2019,Vol.32Issue(1):50-56,7.DOI:10.3969/j.issn.1004-1699.2019.01.009

双层矩形微板谐振器件中热弹性阻尼机理研究

Thermoelastic Damping in Bilayered Rectangular Microplate Resonators

左万里 1黄家瀚1

作者信息

  • 1. 宁波大学机械工程与力学学院, 浙江 宁波 315211
  • 折叠

摘要

Abstract

Applying the integral-transform technique, this work presented an analytical model for thermoelastic damping in the fully clamped bilayered rectangular microplates based on the framework developed by Bishop and Kinra. The present model was validated by comparison with previously reported model and the FEM model. The results demonstrate that two peak will be found when the Zener's modulus of the substrate is much greater or less than that of the film. The thicknesses of the plates have strong influence on thermoelastic damping, while the thermoelastic dissipation spectrums of the microplates are the same for a given thickness, though their shape, width and length are different.

关键词

谐振器/热弹性阻尼/解析模型/双层微板/双峰

Key words

resonator/thermoelastic damping/analytical model/bilayered microplate/double peaks

分类

信息技术与安全科学

引用本文复制引用

左万里,黄家瀚..双层矩形微板谐振器件中热弹性阻尼机理研究[J].传感技术学报,2019,32(1):50-56,7.

基金项目

国家自然科学基金项目(51705261) (51705261)

传感技术学报

OA北大核心CSCDCSTPCD

1004-1699

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