电器与能效管理技术Issue(6)：13-19,52,8.DOI:10.16628/j.cnki.2095-8188.2019.06.003
电磁继电器温度冲击失效机理及工艺控制研究
Study on Failure Mechanism and Process Control of Thermal Shock on Electromagnetic Relay
肖斌 1杨文英 2翟国富 1沈国文1
作者信息
- 1. 哈尔滨工业大学电气工程及自动化学院,黑龙江 哈尔滨 150001
- 2. 贵州振华群英电器有限公司,贵州 贵阳 550018
- 折叠
摘要
Abstract
The thermal shock test requires 20 to 50 cycles in the system test process,while the electromagnetic relay general specification requires only 5 cycles, the differences lead to the relay often failure during the test of thermal shock in the system. Electron microscopy scanning and fault tree analysis were used to analyze the causes of failure of relays after thermal shock test, and the conclusion is that the surface roughness of gold plated contacts and the contact pressure of closed contacts are the cause of this problem. In order to effectively control the adhesion of gold plated contacts, this paper analyzes the difference between domestic and foreign gold plated contacts,and verifies the optimized and improved gold plated contact surface treatment process. The design of the pressure related parameters of the closed contact was carried out by DOE experiment method. The reasonable contact surface treatment process and the control method of closed contact pressure were obtained. The results show that the use of SMAT and vibration pulse plating method can improve the relay contact surface roughness, reduce the adhesion of gold plated contact during the test of thermal shock,at the same time, it can find out the reasonable control parameters,which can ultimately improve the relay thermal shock performance and product quality.关键词
继电器/DOE/温度冲击/表面研磨处理/镀金触点Key words
relay/DOE/thermal shock/surface mechanical attrition treatment(SMAT)/gold plated contacts分类
信息技术与安全科学引用本文复制引用
肖斌,杨文英,翟国富,沈国文..电磁继电器温度冲击失效机理及工艺控制研究[J].电器与能效管理技术,2019,(6):13-19,52,8.
