光学精密工程2019，Vol.27Issue(1)：69-77,9.DOI:10.3788/OPE.20192701.0069
蜂窝状结构半固结磨料研磨盘的制备及应用
Preparation and application of semi-fixed abrasive lapping plates with cecullar structure
摘要
Abstract
In addition to a good surface quality, surface shape accuracy is also necessary.However, it is difficult to guarantee the surface shape accuracy of the substrate during lapping with the general semi-fixed lapping owing to the lapping plate's soft surface.Therefore, we propose a new design and preparation method of semi-fixed lapping plate with cellular structure.The cellular structure made of epoxy resin is designed to play a supporting role, which can reduce the deformation of the lapping plate and improve the surface shape accuracy.The cellular structure is filled with a soft gel with diamond abrasives, which play a role in semi-fixed lapping.Based on this principle, a new structure semi-fixed abrasive lapping plate is prepared and used to lap sapphire substrates.Experimental resultsshow that good surface quality can be obtained with a low surface roughness and a flatter surface with fewer scratches and cracks.Accordingly, the surface shape accuracy of the sapphire substrate has been improved in lapping process.After lapping, the Bow, Warp, and TTV of the substrate are greatly reduced.The lapping efficiency is relatively high, and the material removal rate is 0.3～0.4μm/min.The experimental results indicate not only good surface quality, but an improved surface shape accuracy of the substrate can be obtained by lapping with the new structure semi-fixed abrasive lapping plate.Therefore, this new lapping plate can be used to process the conductor substrates that have a high requirement for both surface quality and surface shape accuracy.关键词
超精密加工/研磨/半固结磨料研磨盘/蓝宝石衬底/面形精度Key words
ultra-precision machining/lapping/semi-fixed abrasive lapping plate/sapphire substrate/surface shape accuracy分类
矿业与冶金引用本文复制引用
王文珊,胡中伟,赵欢,陆静,于怡青,徐西鹏..蜂窝状结构半固结磨料研磨盘的制备及应用[J].光学精密工程,2019,27(1):69-77,9.基金项目
国家自然科学基金面上项目 (No.51575197, No.51675192) （No.51575197, No.51675192）
厦门市科技计划资助项目 (No.3502Z20173047) （No.3502Z20173047）
