化工学报2019，Vol.70Issue(3)：1220-1226,7.DOI:10.11949/j.issn.0438-1157.20180919
基于硅硅低温直接键合的MEMS打印喷头制作工艺
Fabrication process of MEMS print head based on silicon-silicon low temperature direct bonding
摘要
Abstract
Aiming at the processing of complex chamber structure of MEMS piezoelectric integrated print head, a set of fabrication process based on ICP etching combined with silicon-silicon low temperature direct bonding was proposed. Firstly, the upper and lower chamber structures of the print head are separately fabricated by the ICP bulk silicon dry etching process, and then the two silicon wafers with the chamber structures are directly bonded at a low temperature to form a complete print head chamber. Through bonding experiments on the upper and lower chamber structures of the print head, the mechanism of silicon-silicon low temperature direct bonding was further explored and verified. Besides, the effects of different activation methods and annealing time on bonding quality were analyzed, and the bonding process was optimized. The low temperature direct bonding process lays the foundation for the fabrication of MEMS devices with complex three-dimensional structures. The test results show that the finished MEMS print head has a high bonding strength, and the chamber flow channel has good integrity and sealing.关键词
MEMS/低温直接键合/硅/活化/界面/打印喷头/加工制造Key words
MEMS/low temperature direct bonding/silicon/activation/interface/print head/fabrication分类
信息技术与安全科学引用本文复制引用
翟彦昭,蔡安江,张栋鹏,韩超,李力..基于硅硅低温直接键合的MEMS打印喷头制作工艺[J].化工学报,2019,70(3):1220-1226,7.基金项目
国家重点研发计划项目(2017YFB1102900) （2017YFB1102900）
陕西省教育厅科研计划项目(18JS059) （18JS059）
