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Research on technology cluster evolution of global MEMS sensors based on patent co-occurrence analysis①

Liang Qinqin

高技术通讯(英文版)2019,Vol.25Issue(2):197-206,10.
高技术通讯(英文版)2019,Vol.25Issue(2):197-206,10.DOI:10.3772/j.issn.1006-6748.2019.02.011

Research on technology cluster evolution of global MEMS sensors based on patent co-occurrence analysis①

Research on technology cluster evolution of global MEMS sensors based on patent co-occurrence analysis①

Liang Qinqin1

作者信息

  • 1. Institute of Scientific and Technical Information of China , Beijing 100038, P.R.China
  • 折叠

摘要

关键词

co-classification analysis/technology cluster/microelectro mechanical system (MEMS)/patent analysis

Key words

co-classification analysis/technology cluster/microelectro mechanical system (MEMS)/patent analysis

引用本文复制引用

Liang Qinqin..Research on technology cluster evolution of global MEMS sensors based on patent co-occurrence analysis①[J].高技术通讯(英文版),2019,25(2):197-206,10.

基金项目

Supported by the Scientific Monitoring and Key Areas in-depth Investigation Analysis and Research (No.ZD2017-1), Science and Technology Major Specific Project Core Electronic Elements, High-General Chips and Basic Software (No.2015XM54). (No.ZD2017-1)

高技术通讯(英文版)

OAEI

1006-6748

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