舰船电子工程2019，Vol.39Issue(8)：14-18,5.DOI:10.3969/j.issn.1672-9730.2019.08.005
电子设备散热技术的发展
Development of Heat Dissipation Technology for Electronic Equipment
谢远成 1欧中红1
作者信息
- 1. 中国船舶重工集团第七0九研究所 武汉 430205
- 折叠
摘要
Abstract
As electronic device technology geometries shrink,electronic devices are also increasingly moving toward miniatur?ization,integration,and high frequency. Circuit system complexity is increasing and electronic device heat flux density is increas?ing,excessive temperature rise will definitely affect the reliability of electronic products. The thermal failure of electronic devices caused by high temperature is increasing in the proportion of the entire electronic equipment problem that seriously affects the use of electronic devices. This article will analyze the heat dissipation from the two aspects of the heat dissipation status of electronic devic?es and the new heat dissipation methods of electronic devices,also will analyze and compare related cooling technologies. Thereby the future development trend of heat dissipation design for electronic devices is predicted.关键词
电子设备/散热技术/热流密度Key words
electronic devices/heat dissipation technology/heat flux density分类
信息技术与安全科学引用本文复制引用
谢远成,欧中红..电子设备散热技术的发展[J].舰船电子工程,2019,39(8):14-18,5.
