哈尔滨工业大学学报（英文版）2020，Vol.27Issue(1)：91-96,6.DOI:10.11916/j.issn.1005⁃9113.18065
Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger
Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger
Diancheng Qin 1Kewei Liang2
作者信息
- 1. Guangdong LED Packaging-Used Heat Dissipation Substrate Engineering Technology Research Center, Zhuhai 519180, Guangdong,China
- 2. Rayben Technologies (Zhuhai) Limited, Zhuhai 519180, Guangdong,China
- 折叠
摘要
关键词
MHE/MCPCB/heat dissipation performance/LED/optical propertyKey words
MHE/MCPCB/heat dissipation performance/LED/optical property分类
通用工业技术引用本文复制引用
Diancheng Qin,Kewei Liang..Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger[J].哈尔滨工业大学学报（英文版）,2020,27(1):91-96,6.
