首页|期刊导航|自动化学报（英文版）|Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

Jipeng Wang Hesuan Hu Chunrong Pan Yuan Zhou Liang Li

自动化学报（英文版）2020，Vol.7Issue(3)：776-789,14.

自动化学报（英文版）2020，Vol.7Issue(3)：776-789,14.DOI:10.1109/JAS.2020.1003150

Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

Jipeng Wang ¹Hesuan Hu ²Chunrong Pan ³Yuan Zhou ¹Liang Li¹

作者信息

1. School of Mechano-Electronic Engineering,Xidian University,Xi'an 710071,China
2. School of Mechanical and Electrical Engineering,Ji-angxi University of Science and Technology,Ganzhou 341000,China
3. School of Computer Science and Engineering,College of Engineering,Nanyang Technological University,Singapore 639798,Singapore
折叠

摘要

关键词

Cluster tools/multiple wafer types/scheduling/semi-conductor manufacturing/wafer fabrication

Key words

Cluster tools/multiple wafer types/scheduling/semi-conductor manufacturing/wafer fabrication

引用本文复制引用

Jipeng Wang,Hesuan Hu,Chunrong Pan,Yuan Zhou,Liang Li..Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints[J].自动化学报（英文版）,2020,7(3):776-789,14.

基金项目

This work was supported in part by the National Natural Science Foundation of China (71361014,61973242,61573265,51665018) and the Major Funda-mental Research Program of the Natural Science Foundation of Shaanxi Province (2017ZDJC-34). （71361014,61973242,61573265,51665018）

自动化学报（英文版）

OACSCDCSTPCDEI

ISSN：2329-9266

访问量5

下载量0

段落导航