燕山大学学报2020，Vol.44Issue(4)：347-352,6.DOI:10.3969/j.issn.1007-791X.2020.04.003
脉冲电流对铜热浸镀铝界面扩散行为的影响机理分析
Influence of pulse current on interface diffusion behavior of copper hot dip aluminum plating
摘要
Abstract
The regulation of cropper hot-dip aluminized interfacial diffusion layer with good bonding strength and diffusion layer properties are studied by applying high-frequency currents with different current intensities and pulse frequencies during the preparation process. The influence of pulse current parameters and electrode connection methods on the diffusion behavior of cropper/aluminum composite interface is studied. The study results show that the current density has an influence on the atomic diffusion mode by pulse current. The quantitative control of the thickness of the diffusion layer can be obtained by specific pluse parameters, but it does not affect the distribution of copper and aluminum content. In the range of 0.9× 106 A/m2 to 2.84×106 A/m2, as the current density increases, the thickness of the diffusion layer first decreases, and then increases regardless of whether the copper substrate is connected to the positive electrode or the negative electrode. The pulse frequency is gradually increased from 400 Hz to 600 Hz, and as the pulse frequency increases, the thickness of the diffusion layer is reduced. The difference between the electric wind and the resistance of the atom is a main reason that affects the interdiffusion between the liquid metal atoms in the electric field. The use of the pulse current has an influence on the atom diffusion mode. Therefore, the quantitative control of the thickness of the diffusion layer can be obtained by specific pulse parameters. The study results provide a new alternative method for controlling the bonding properties and conductivity of layered composites.关键词
脉冲电流/铜热浸镀铝/复合界面/铜/铝复合材料/扩散行为Key words
pulse current/ cropper hot dip aluminizing/composite interface/ cropper/aluminum composite/ diffusion behavior分类
矿业与冶金引用本文复制引用
张俊鹏1,2,黄华贵1,2*,燕猛1,2,刘冬冬1,2,赵阳1,2..脉冲电流对铜热浸镀铝界面扩散行为的影响机理分析[J].燕山大学学报,2020,44(4):347-352,6.基金项目
国家自然科学基金资助项目(51474189) （51474189）
河北省杰出青年基金资助项目(E2018203446) （E2018203446）
